APPARATUS AND METHOD FOR CUTTING LED MATERIALS OR SEMICONDUCTOR MATERIALS CAPABLE OF REDUCING A DEFECTIVE RATE OF AN LED UNIT

摘要

PURPOSE: An apparatus and method for cutting LED materials or semiconductor materials are provided to increase the lifetime of a chuck table by protecting the chuck table through a cut process based on the chuck table.;CONSTITUTION: A blade assembly includes one or more blades. A chuck table includes a body block(220), a receiving unit(230), and a reference point(235). The receiving unit includes a blade escape groove(231), a vacuum tube(234), and a receiving groove(236). The vacuum tube fixes LED materials to correspond to an LED unit. The receiving groove receives a lens part of the LED material.;COPYRIGHT KIPO 2013