EPOXY RESIN COMPOSITION HAVING EXCELLENT ELECTRICAL CHARACTERISTICS FOR SEALING SEMICONDUCTOR

摘要

The present invention is at least one epoxy curing agent , a curing accelerator , a filler to impart mechanical strength , pigments , relates to an epoxy resin composition for sealing a semiconductor device comprising the silane and the like. The additive having a crystal structure shown in Figure 4 as cerium oxide (CeO ₂ ) can be used. When sealing a semiconductor element using the epoxy resin composition according to the invention , which is one of the electrical characteristics HTRB. ( High temperature reverse bias ; high temperature reverse bias) shows excellent properties in item ;