首页> 外国专利> IMAGING METHOD CAPABLE OF IMAGING A SUBSURFACE STRUCTURE OF AN INDUSTRIAL MATERIAL OF NANO SCALE DEPTH AND AN IMAGING DEVICE, CAPABLE OF BEING UTILIZED FOR A MATERIAL PROPERTY FIELD

IMAGING METHOD CAPABLE OF IMAGING A SUBSURFACE STRUCTURE OF AN INDUSTRIAL MATERIAL OF NANO SCALE DEPTH AND AN IMAGING DEVICE, CAPABLE OF BEING UTILIZED FOR A MATERIAL PROPERTY FIELD

机译:能够对纳米级深度的工业材料和成像设备的亚表面结构进行成像的成像方法,能够用于材料性能领域

摘要

PURPOSE: An imaging method capable of imaging a subsurface structure of an industrial material of nano scale depth and an imaging device are provided to enable to analyze a subsurface structure of an industrial material by an economical and non-destructive method, thereby contributing to a development and the concealment structure detection of a material analyzing system.;CONSTITUTION: An imaging method capable of imaging a subsurface structure of an industrial material of nano scale depth comprises next steps. Incident rays having different frequencies are incident to a material of an analysis object(S1). An object supporting member in which the analysis object is positioned is moved for two-dimensionally scanning along a surface of the object(S5). Images of lights reflected by the object material are obtained(S2). The images of the obtained reflecting lights are two-dimensionally dimensionalized and an analysis result is drawn(S3). Images of a two-dimensional shape of the processed analysis result are output and displayed(S4).;COPYRIGHT KIPO 2013;[Reference numerals] (S1) Injecting incident rays to an analysis object material; (S2) Obtaining images of reflected lights; (S3) Processing the images into two-dimensional images and drawing an analysis resu (S4) Outputting/displaying the processed two-dimensional images; (S5) Moving the analysis object material
机译:目的:提供一种能够对纳米级深度的工业材料的亚表面结构进行成像的成像方法和成像装置,以能够通过经济且无损的方法来分析工业材料的亚表面结构,从而为开发做出贡献组成:一种能够对纳米级深度的工业材料的表面结构进行成像的成像方法,包括以下步骤。具有不同频率的入射射线入射到分析对象的材料(S1)。移动放置有分析对象的对象支撑部件,以沿着该对象的表面进行二维扫描(S5)。获得由物体材料反射的光的图像(S2)。将获得的反射光的图像二维化,并得出分析结果(S3)。输出并显示已处理的分析结果的二维形状的图像(S4)。; COPYRIGHT KIPO 2013; [参考数字](S1)将入射射线注入分析对象材料; (S2)获取反射光的图像; (S3)将图像处理成二维图像并得出分析结果; (S4)输出/显示处理后的二维图像; (S5)移动分析对象素材

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