ELECTRICAL PLATING DEVICE AND AN ELECTROPLATING METHOD, CAPABLE OF UNIFORMLY FORMING THE THICKNESS OF A THIN METAL FILM ON A LARGE SUBSTRATE, AND SECURING A GRAIN SIZE

摘要

PURPOSE: An electrical plating device and an electroplating method are provided to shorten a plating time and to uniformly form the thickness of a metal thin film by not requiring a pattern forming process of a metal wiring having a low resistance value.;CONSTITUTION: An electrical plating device includes a water tank(50), a copper electrode(56), an actuating part(64), and a power supplier(54). The water tank is filled with a nonpolar solvent(52) which has a greater specific gravity than an electrolyte. The electrolyte layer is formed on the upper surface of the nonpolar solvent. The copper electrode is mounted on the portion of the electrolyte layer in the water tank. An insulating substrate(11) is placed to be inserted into and ejected from the inside of the water tank. A seed electrode(12) is formed on the insulating substrate(11). The actuating part elevates the insulating substrate. The power supplier applies an electric current between the coppper electrode and the seed electrode. Chloroform having the specific gravity of 1.5 grams per milliliter is used as the nonpolar solvent.;COPYRIGHT KIPO 2013