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Effect of the Formation of the Intermetallic Compounds between a Tin Bump and an Electroplated Copper Thin Film on both the Mechanical and Electrical Properties of the Jointed Structures

机译：锡凸块和电镀铜薄膜在接合结构的机械和电学两者之间形成金属间化合物的影响

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Seongcheol Jeong; Naokazu Murata; Yuki Sato; Ken Suzuki; Hideo Miura;
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Effect of the Formation of the Intermetallic Compounds between a Tin Bump and an Electroplated Copper Thin Film on both the Mechanical and Electrical Properties of the Jointed Structures

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