THIN FILM ELECTRODE CERAMIC SUBSTRATE CAPABLE OF IMPROVING AN ADHESION FORCE OF THE ENTIRE THIN FILM ELECTRODE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A thin film electrode ceramic substrate and manufacturing method thereof are provided to prevent occurrence of undercut due to an etchant solution between the surface of a substrate and electrode pattern, and between electrode patterns by forming a plating layer in the upper part of a thin film electrode pattern and both sides or by forming an etch prevention metal layer having an intaglio shape in the surface of a ceramic substrate.;CONSTITUTION: An electrode pattern(111,112) is formed in a ceramic substrate(110). A plating layer(114,115) is formed in the electrode pattern. An etch prevention metal layer(121a,121b) is formed in the surface of the ceramic substrate. The electrode pattern is formed on the etch prevention metal layer. Each edge part of the electrode pattern is bonded to the etch prevention metal layer. The plating layer is formed in the upper part and the both sides of the electrode pattern and the etch prevention metal layer.;COPYRIGHT KIPO 2013