LIGHT EMITTING DIODE PACKAGE AND A PRINTED CIRCUIT BOARD INCLUDING THE SAME CAPABLE OF CONNECTING AN ANODE AND A CATHODE OF A LIGHT EMITTING DIODE CHIP TO PADS OF A SIGNAL PAD UNIT USING A CONNECTION WIRE

摘要

PURPOSE: A light emitting diode package and a printed circuit board including the same are provided to reduce the width of the printed circuit board by connecting light emitting diode packages with a connection wire or connection pattern.;CONSTITUTION: A light emitting diode chip(150) is formed in a package body. A wall(120) is formed on the package body around the light emitting diode chip. A first signal pad unit(240a) and a second signal pad unit(240b) include pads formed on both sides of the light emitting diode chip. A first lead frame(250a) and a second lead frame(250b) are located on both sides of the package body. The first lead frame and the second lead frame are electrically connected to one of the first signal pad unit and the second signal pad unit. An optical lens is attached to form the same plane as the upper side of the wall formed in the package body.;COPYRIGHT KIPO 2013