首页> 外国专利> MANUFACTURING METHOD OF A COPOLYMERIZATION POLYAMIDE-IMIDE FILM WITH EXCELLENT TRANSPARENCY, HEAT RESISTANCE, MECHANICAL PROPERTIES, AND LOW THERMAL EXPANSION COEFFICIENT

MANUFACTURING METHOD OF A COPOLYMERIZATION POLYAMIDE-IMIDE FILM WITH EXCELLENT TRANSPARENCY, HEAT RESISTANCE, MECHANICAL PROPERTIES, AND LOW THERMAL EXPANSION COEFFICIENT

机译:具有优异的透明性,耐热性,机械性能和低热膨胀系数的共聚聚酰胺酰亚胺薄膜的制造方法

摘要

PURPOSE: A manufacturing method of a copolymerization polyamide-imide film is provided to have excellent thermal, mechanical, and optical performance.;CONSTITUTION: A manufacturing method of a copolymerization polyamide-imide film is a unit structure derived from TFDB(2,2`-bis trifluoromethyl-4,4`-biphenyl diamine), a unit structure derived from 6FDA(4,4`-(hexafluoroisopropylidene)diphthalic anhyide), a unit structure derived from BPDA(3,3`,4,4`-Biphenyltetracarboxylic dianhydride), and a unit structure derived from TPC(terephthaloyl chloride). The copolymerization ratio of the unit structure from TFDB, the unit structure from 6FDA, the unit structure from BPDA is 1:0.2-0.8:0.8-0.2.;COPYRIGHT KIPO 2013
机译:目的:提供一种具有优异的热,机械和光学性能的共聚聚酰胺-酰亚胺薄膜的制造方法。;组成:共聚聚酰胺-酰亚胺薄膜的制造方法是衍生自TFDB(2,2` -双三氟甲基-4,4`-联苯二胺),衍生自6FDA(4,4`-(六氟异亚丙基)二邻苯二甲酸酐)的单元结构,衍生自BPDA(3,3`,4,4`-联苯四羧酸二酐)和衍生自TPC(对苯二甲酰氯)的单元结构。来自TFDB的单元结构,来自6FDA的单元结构,来自BPDA的单元结构的共聚比为1:0.2-0.8:0.8-0.2。; COPYRIGHT KIPO 2013

著录项

  • 公开/公告号KR20130035691A

    专利类型

  • 公开/公告日2013-04-09

    原文格式PDF

  • 申请/专利权人 KOLON INDUSTRIES INC.;

    申请/专利号KR20110100151

  • 发明设计人 PARK HYO JUN;JUNG HAK GEE;

    申请日2011-09-30

  • 分类号C08J5/18;C08G73/14;C08L79/08;

  • 国家 KR

  • 入库时间 2022-08-21 16:27:25

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