THIN FILM BONDING SUBSTRATE AND A MANUFACTURING METHOD THEREOF CAPABLE OF REDUCING MANUFACTURING COSTS AND IMPROVING QUALITY

摘要

PURPOSE: A thin film bonding substrate and a manufacturing method thereof are provided to prevent a crack due to thermal deformation mismatch by reducing the different thermal deformation of a crystal thin film and a heterogeneous substrate.;CONSTITUTION: A heterogeneous substrate(140) is bonded to a crystal thin film(111). The chemical composition of the heterogeneous substrate is different from the chemical composition of the crystal thin film. A metal material layer(130) is interposed between the crystal thin film and the heterogeneous substrate and controls a thermal deformation difference between the crystal thin film and the heterogeneous substrate. The thickness of the metal material layer is 1 to 2000 um.;COPYRIGHT KIPO 2013