BONDING WIRE FOR A SEMICONDUCTOR DEVICE USING SILVER AS A MAIN ELEMENT, A MANUFACTURING METHOD, AND A LIGHT EMITTING DIODE PACKAGE INCLUDING THE SAME

摘要

PURPOSE: A bonding wire for a semiconductor device, a manufacturing method thereof, and a light emitting diode package including the same are provided to improve productivity and mechanical intensity and to prevent discoloration by adding alloy elements to silver.;CONSTITUTION: A light emitting diode chip(10) is mounted on the lower side of a cavity(30). A lead frame(20) applies power to the light emitting diode chip. A bonding wire(50) connects the light emitting diode chip to the lead frame. An electrode(40) is formed on the upper side of the light emitting diode chip. A phosphor(60) is coated in the cavity.;COPYRIGHT KIPO 2013