INTEGRATED CIRCUIT MANUFACTURING TOOL CONDITION MONITORING SYSTEM WHICH EVALUATES THE CONDITION OF AN INTEGRATED CIRCUIT MANUFACTURING PROCESS TOOL BASED ON GROUPED PARAMETERS AFTER GROUPING THE PARAMETERS BASED ON DEFINED ZONES AND A METHOD THEREOF

摘要

PURPOSE: An integrated circuit manufacturing tool condition monitoring system and a method thereof are provided to monitor tools during processing and to identify faults which cause unexpected processing results in the tools.;CONSTITUTION: A database(25) stores data associated with an integrated circuit manufacturing system. A process tool(30) performs an integrated circuit fabrication process. A metrology tool(40) measures and collects data associated with wafers during integrated circuit fabrication. An APC system(50) monitors wafer characteristics of the processed wafers and uses inline metrology data, process models, and various algorithms to provide dynamic fine-tuning of intermediate process targets to enhance final device targets of the wafers. An FDC system(60) evaluates conditions of a process tool to detect tool issues, such as tool condition deterioration, by monitoring parameters implemented by the process tool during the integrated circuit fabrication process, The FDC system evaluates wafer characteristics achieved by the parameters implemented by the process tool during the integrated circuit fabrication process.;COPYRIGHT KIPO 2013;[Reference numerals] (20) Network; (25) Database; (30) Process tool; (40) Metrology tool; (50) APC system; (60) FDC system; (70) Other entity