首页> 外国专利> PHOTOCURABLE RESIN COMPOSITION CAPABLE OF PROVIDING AN EXCELLENT IMITATION MOLD WITH HIGH YOUNG'S MODULUS AND ELASTICITY, FLEXIBILITY, AND GAS PERMEABILITY, AND A MANUFACTURING METHOD OF THE IMITATION MOLD

PHOTOCURABLE RESIN COMPOSITION CAPABLE OF PROVIDING AN EXCELLENT IMITATION MOLD WITH HIGH YOUNG'S MODULUS AND ELASTICITY, FLEXIBILITY, AND GAS PERMEABILITY, AND A MANUFACTURING METHOD OF THE IMITATION MOLD

机译:可提供具有高杨氏模量和弹性,柔韧性和透气性的优良仿模的光固化树脂组合物,以及该仿模的制造方法

摘要

PURPOSE: A photocurable resin composition is provided to make an additional releasing agent treatment unnecessary, and to satisfy low viscosity, low surface tension, high Young's modulus, wide range elasticity, a low shrinkage ratio, a low swelling rate, high transparency, and high gas permeability.;CONSTITUTION: A photocurable resin composition comprises a photoreactive polymer that polydimethylsiloxane is coupled to silsesquioxane which has one or more polymerizable functional groups. The weight average molecular weight of the polydimethylsiloxane is 1,000-4,000. A manufacturing method of the imitation mold comprises a step of spreading the photocurable resin composition on a first substrate; and a step of arranging a second substrate on the first substrate, and curing the same.;COPYRIGHT KIPO 2013
机译:用途:提供一种光固化树脂组合物,无需进行额外的脱模剂处理,并满足低粘度,低表面张力,高杨氏模量,宽范围弹性,低收缩率,低溶胀率,高透明度和高粘度的要求组成:一种光固化树脂组合物,其包含光反应性聚合物,其中聚二甲基硅氧烷与具有一个或多个可聚合官能团的倍半硅氧烷偶联。聚二甲基硅氧烷的重均分子量为1,000-4,000。仿模的制造方法包括以下步骤:将光固化性树脂组合物铺展在第一基板上。在第一基板上配置第二基板并使其固化的步骤。COPYRIGHTKIPO 2013

著录项

  • 公开/公告号KR20130062054A

    专利类型

  • 公开/公告日2013-06-12

    原文格式PDF

  • 申请/专利号KR20110128462

  • 发明设计人 LEE BONG KUK;

    申请日2011-12-02

  • 分类号C08G77/04;C08L83/04;B29C33/38;

  • 国家 KR

  • 入库时间 2022-08-21 16:26:57

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