POLYMER COMPOSITE WITH IMPROVED ELECTRIC CONDUCTIVITY, THERMAL STABILITY, AND MECHANICAL PROPERTIES AND A LEAD-FREE SOLDER CONTAINING THE POLYMER COMPOSITE

摘要

PURPOSE: An epoxy resin/silver/reduced graphene oxide composite is provided to have improved thermal conductivity and mechanical performance, and to have high electric conductivity even at a low silver content by adding reduced graphene oxide.;CONSTITUTION: A composite includes 10-50 wt% of silver, 1-60 wt% of reduced graphene oxide, and 10-40 wt% of an epoxy resin. The silver can be a silver nanowire. A lead-free solder including the composite can be in a film, cream, ribbon, filament, or rod shape. The soldered product or electronic component is formed by bonding with the lead-free solder.;COPYRIGHT KIPO 2013