首页> 外国专利> META-ARAMID-BASED FILM WITH IMPROVED ELECTRICAL INSULATING AND STRENGTH BY OPTIMIZING THE RATIO OF A FIBRID AND A FLOC AND THE FREENESS OF THE FIBRID, THEREBY IMPROVING BOTH ELECTRICAL INSULATING AND STRENGTH

META-ARAMID-BASED FILM WITH IMPROVED ELECTRICAL INSULATING AND STRENGTH BY OPTIMIZING THE RATIO OF A FIBRID AND A FLOC AND THE FREENESS OF THE FIBRID, THEREBY IMPROVING BOTH ELECTRICAL INSULATING AND STRENGTH

机译:通过优化纤维和泡沫的比例以及纤维的游离度,改善了电绝缘性和强度的基于亚芳族聚酰胺的薄膜,从而同时改善了电绝缘性和强度

摘要

PURPOSE: A meta-aramid-based film is provided to improve strength and dehydration without the loss of electrical insulating performance, and to have excellent electrical insulating performance and mechanical strength.;CONSTITUTION: A meta-aramid-based film includes a raw sheet (100) which contains meta-aramid fibrids and flocs with a weight ratio of 1:9-3:7. The Canadian standard freeness of the fibrid is 100 ml or less. The film includes a surface layer (210) and a backside layer (230) formed on both sides of the fibrid. The surface layer and the backside layer are formed by an electrospinning. The thickness ratio of the surface layer, the raw sheet, and the back side layer is 1:40-60:1. The film is manufactured by a calendering at 270-290 °C.;COPYRIGHT KIPO 2013
机译:目的:提供一种间位芳纶基薄膜,以提高强度和脱水而不会损失电绝缘性能,并具有优异的电绝缘性能和机械强度。 100),其包含重量比为1:9-3:7的间位芳族聚酰胺纤条体和絮状物。纤条体的加拿大标准游离度为100毫升或更少。该膜包括在纤条体的两侧上形成的表面层(210)和背面层(230)。表面层和背面层通过静电纺丝形成。表面层,生片和背面层的厚度比为1:40-60:1。该膜是通过在270-290°C的压延机上制造的; COPYRIGHT KIPO 2013

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