EPOXY RESIN COMPOSITION FOR SEALING A SEMICONDUCTOR DEVICE, CAPABLE OF OBTAINING EXCELLENT FLAME RETARDANCY WITHOUT USING A FLAME RETARDANT AND THE SEMICONDUCTOR DEVICE SEALED BY USING THE SAME

摘要

PURPOSE: An epoxy resin composition is provided to have a low contraction ratio and a high glass transition temperature, thereby having excellent package flexural performance and to have excellent reliability by having sufficient adhesion and moisture absorption resistance.;CONSTITUTION: An epoxy resin composition comprises an epoxy resin, a hardener, a hardening accelerator, and an inorganic filler. The epoxy resin includes a phenolaralkyl type epoxy resin containing a biphenyl group which has repeating units represented by chemical formula 1-1 and chemical formula 1-2. In chemical formula 1-1, R1 and R2 are independently hydrogen or a C1-5 linear or branched alky group; each of a, b, and a+b is an integer from 0-5. In chemical formula 1-2, each of R1 and R2 is independently hydrogen or a C1-5 linear or branched alkyl group; and each of a and b is an integer from 0-4.;COPYRIGHT KIPO 2013