CU/AL CLAD MATERIAL WITH HIGH STRENGTH AND INTERFACIAL RELIABILITY THROUGH ALLOYING, AND THE METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A cooper or aluminum cladded material is provided to offer excellent electronic characteristics and intensity by increasing the intensity without reducing conductivity in a copper material or an aluminum material. CONSTITUTION: A cladded material has a lamination structure in which copper materials and aluminum material are laminated. The copper material comprises an alloy element selected from an alloy element group comprising Cr, Zr, Ag, Mg, Mn, Ti, Nb, Fe, and Co and another alloy element selected from the alloy element group comprising Cr, Zr, Ag, Mg, Mn, Ti, Nb, Fe, Co, and Si. The content of the alloy element includes the Cu base is the 0.01-10 weight % of Ag, Nb, Fe, and Cr or the 0.01-5 weights % of Zr, Mg, Mn,Ti, and Co. [Reference numerals] (10) Cu alloy; (20) AI alloy