STRUCTURE OF A LEAD FRAME AND A MOLD FOR AN LED PACKAGE CAPABLE OF INCREASING THE DEGREE OF INTEGRATION AND A MANUFACTURING PROCESS THEREOF

摘要

PURPOSE: A structure of a lead frame and a mold for an LED package and a manufacturing process thereof are provided to minimize a failure rate due to a burr by making the lead frame and a lower mold in the same size.;CONSTITUTION: A mold is divided into an upper mold and a lower mold (11). A lead frame is inserted between the upper mold and the lower mold for packaging. Cores of a packaged part of the lead frame and the mold are of the same size. An empty space of the lead frame is used for an inlet of an extruded product.;COPYRIGHT KIPO 2013