THERMOCONDUCTIVE RESIN COMPOSITION CAPABLE OF FORMING A THERMAL CONDUCTIVE SHEET WITH EXCELLENT HEAT CONDUCTIVITY AND A THERMALLY CONDUCTIVE SHEET USING THE SAME

摘要

PURPOSE: A thermoconductive resin composition has high heat resistance and can obtain a thermally conductive sheet with low hardness and high surface adhesion.;CONSTITUTION: A thermoconductive resin composition comprises a fluorine-based compound which has 1-2 of hydrosilyl groups at the end of the molecule and of which the content of molecules having two hydrosilyl groups is 60-100 mol%; a fluorine-based compound which has 1-2 of hydrosilyl groups at the end of the molecule and of which the content of molecules having two alkenyl groups is 60-100 mol%; a fluorine-based compound which has 1-2 of hydrosilyl groups at the end of the molecule and of which the content of molecules having two hydrosilyl groups is 0-40 mol%; a fluorine-based compound which has 1-2 of hydrosilyl groups at the end of the molecule and of which the content of molecules having two alkenyl groups is 0-40 mol%; and a thermally conductive filler.;COPYRIGHT KIPO 2013