首页> 外国专利> HEATING DEVICE CAPABLE OF MAINTAINING A CENTER-COOL TEMPERATURE DISTRIBUTION AND A SEMICONDUCTOR MANUFACTURING APPARATUS

HEATING DEVICE CAPABLE OF MAINTAINING A CENTER-COOL TEMPERATURE DISTRIBUTION AND A SEMICONDUCTOR MANUFACTURING APPARATUS

机译:能够保持中心冷却温度分布和半导体制造装置的加热装置

摘要

PURPOSE: A heating device and a semiconductor manufacturing apparatus are provided to easily control temperature by preventing a high increase in the temperature of the lower part of a hollow shaft.;CONSTITUTION: A ceramic body (20) has a disk shape. The ceramic body has a wafer mounting surface. A resistance heating element (22) is installed within the ceramic body or on the surface of the ceramic body. A hollow shaft (40) is bonded to the wafer mounting part and a facing surface. The ceramic body includes a central part and a peripheral part.;COPYRIGHT KIPO 2013;[Reference numerals] (48) Power source circuit; (50) Controller
机译:目的:提供一种加热装置和半导体制造设备,以通过防止中空轴下部温度的高升高来容易地控制温度。;组成:陶瓷体(20)具有圆盘形状。陶瓷体具有晶片安装表面。电阻加热元件(22)安装在陶瓷体内或陶瓷表面上。中空轴(40)结合到晶片安装部分和面对表面。陶瓷主体包括中心部分和外围部分。; COPYRIGHT KIPO 2013; [参考数字](48)电源电路; (50)控制器

著录项

  • 公开/公告号KR20130107229A

    专利类型

  • 公开/公告日2013-10-01

    原文格式PDF

  • 申请/专利权人 NGK INSULATORS LTD.;

    申请/专利号KR20130028004

  • 发明设计人 UNNO YUTAKA;WAKI JUNYA;

    申请日2013-03-15

  • 分类号H01L21/205;H01L21/324;

  • 国家 KR

  • 入库时间 2022-08-21 16:26:11

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