A PLATING APPARATUS AND A PLATING METHOD USING A PLATING APPARATUS

摘要

PURPOSE: A plating device and a plating method using the same are provided to simplify a process and to reduce manufacturing costs by omitting a masking as a plated portion is opened and a plating device is closely adhered to an unplated portion. CONSTITUTION: A plating device comprises a metal electrode unit(10), a body unit(20), and a passage portion(30). The electrode unit is formed in a longitudinal direction. The body unit is formed in correspondence to an inner side wall of a cylinder cover. A plurality of supporters is formed in a portion where plating is not necessary so that the body unit is closely adhered to the inner side wall. The body unit is opened in a portion where plating is necessary. The passage portion passes through the body unit in a longitudinal direction. Recessed portions(24) are formed on the edges of the upper and lower ends of the supporters and formed into a step shape.