SYSTEM USING CAPACITANCE SENSORS ARRAY FOR MEASURING THE HORIZONTALITY AND THE PRESSURE OF A CULLET, CAPABLE OF IMPROVING THE RELIABILITY OF MEASUREMENT

摘要

PURPOSE: A system using capacitance sensors array for measuring the horizontality and the pressure of a cullet is provided to measure the horizontal pressure of the cullet by using the capacitance sensor array automatically on a real time basis, thereby improving yield as a bonding process is not stopped.;CONSTITUTION: A system using capacitance sensors array for measuring the horizontality and the pressure of a cullet(34) comprises a wafer stage(10), a bonding stage(20), a capacitance sensor array panel(40), a bonding head(33), and a controller. A wafer(11) having a plurality of semiconductor chips is formed on the wafer stage. A substrate for bonding the semiconductor chips is loaded on the wafer stage. The capacitance sensor array panel is arranged between the wafer stage and the bonding stage and includes a plurality of the capacitance sensors The bonding head adsorbs the surfaces of the semiconductor chips with the cullet, moves the semiconductor chips to a bonding position, bonds the semiconductor chips on a substrate, and presses the capacitance sensor array panel by using the cullet at a constant cycle.;COPYRIGHT KIPO 2013