METHOD OF MANUFACTURING AN LED FLASH MODULE USNIG REFLOW SOLDERING BONDING PROCESS AND AN LED FLASH MODULE MANUFACTURED THEREBY

摘要

PURPOSE: A method for manufacturing an LED flash module using a reflow soldering bonding process and the LED flash module manufactured thereby are provided to improve processing efficiency by using an SMD mounting method for assembling components. CONSTITUTION: A through hole is formed in the center of a metal frame (106). A heat pressure discharge groove is formed in the upper part of the metal frame. The metal frame is inserted into a mold. The metal frame is combined with an optical lens and a body. An LED (110) is mounted on a PCB (108) by a surface mounting device (SMD) method.