PRESSURE-SENSITIVE ADHESIVE TAPE OR SHEET FOR APPLICATION TO ACTIVE SURFACE IN DICING AND METHOD OF PICKING UP CUT PIECES OF WORK

摘要

The present invention relates to a pressure-sensitive adhesive tape or sheet for dicing, which includes a substrate and a pressure-sensitive adhesive layer disposed on at least one side of the substrate, in which the pressure-sensitive adhesive layer disposed on at least one side of the substrate contains a compound having a hydroxy group or a derivative thereof in an amount of 2 to 12% by weight based on all ingredients, and in which the pressure-sensitive adhesive tape or sheet is to be applied to an active surface in the state of being not wholly covered with a native oxide film. The compound having a hydroxy group or the derivative thereof preferably is a polyalkylene glycol or a derivative thereof The pressure-sensitive adhesive layer preferably is a radiation-curable pressure-sensitive adhesive layer.