Systems and methods of a carrier device for positioning vonthermisohen interfaces - materials

摘要

A support device for placement of thermal interfaces - materials. At least some embodiments, the systems are designed to comprise a first electrical component, which has a first surface against a first raised relative to an underlying structure, a second electrical component, which a second surface against a second raised relative to the underlying structure, a metallic member, which is configured in order to heat from the electrical components to conduct, and a carrier between the electrical components and the metallic member. The carrier includes a third and fourth surface, which are configured in order, with the first and second surface of said, a first aperture through the third surface and a second aperture through the fourth surface. In addition, the system includes a first thermal interfaces - material, the between the first electrical component and the metallic member is coupled, by means of the first aperture, and a second thermal interfaces - material, the between the second electrical component and the metallic member is coupled, by means of the second aperture.