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High performance lighting LED packet for e.g. communication device, has silicone volumes evenly distributed on surface of optical transparent plate to effectively break light beams of LED chips and enlarge lighting region

机译:高性能照明LED包,例如通信设备,硅树脂的体积均匀地分布在光学透明板的表面,从而有效地打破了LED芯片的光束并扩大了照明区域

摘要

The packet has LED chips (30) mounted in a housing (11) and electrically connected with a base (10), and an optical transparent plate (20) mounted on a top surface of the housing. Grooves are evenly formed on the Surface of the plate, and a silicone volume (40) mixed with phosphorus powder is injected in each groove such that the silicone volumes are evenly distributed on the surface of the plate to effectively break the light beams of the LED chips and enlarge the lighting region. The housing is secured on a surface of the base.
机译:该包装盒具有安装在壳体(11)中并与基座(10)电连接的LED芯片(30),以及安装在壳体的顶表面上的光学透明板(20)。在板表面上均匀地形成凹槽,并在每个凹槽中注入与磷粉混合的硅树脂体积(40),以使硅树脂体积均匀地分布在板表面上,从而有效地破坏LED的光束芯片并扩大照明区域。外壳固定在基座的表面上。

著录项

  • 公开/公告号DE102011054943A1

    专利类型

  • 公开/公告日2013-05-02

    原文格式PDF

  • 申请/专利权人 RUIYUN OPTOELECTRONICS LIGHT TECHNOLOGY LTD.;

    申请/专利号DE20111054943

  • 发明设计人 CHEN CHAO-CHUAN;

    申请日2011-10-31

  • 分类号H01L25/075;H01L33/56;H01L33/58;F21V5;

  • 国家 DE

  • 入库时间 2022-08-21 16:22:25

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