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High performance lighting LED packet for e.g. communication device, has silicone volumes evenly distributed on surface of optical transparent plate to effectively break light beams of LED chips and enlarge lighting region
High performance lighting LED packet for e.g. communication device, has silicone volumes evenly distributed on surface of optical transparent plate to effectively break light beams of LED chips and enlarge lighting region
The packet has LED chips (30) mounted in a housing (11) and electrically connected with a base (10), and an optical transparent plate (20) mounted on a top surface of the housing. Grooves are evenly formed on the Surface of the plate, and a silicone volume (40) mixed with phosphorus powder is injected in each groove such that the silicone volumes are evenly distributed on the surface of the plate to effectively break the light beams of the LED chips and enlarge the lighting region. The housing is secured on a surface of the base.
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