Method for electrically controlling soldering of quad flat package building block in integrated circuit, involves applying zone with potential of pad to test soldering of another zone, where voltage drop is evaluated to assess soldering

摘要

The method involves segmenting a strip conductor in a region of a metallic surface of a cooling pad (13), where the strip conductor comprises zones electrically insulated from each other. One of the zones is electrically applied with potential of the cooling pad to test soldering of the other zone with testing voltage potential, where voltage drop or current flow is evaluated to assess the soldering. The quality of soldering of the cooling pad with the strip conductor is evaluated based on voltage drop or current flow, where the pad is designed as a heat sink. An independent claim is also included for a test arrangement.