首页> 外国专利> Metal gate electrodes structures with a large is epsilon (ε), which, by means of a reduction of the gate of the filling aspect ratio in a replacement gate technology are produced

Metal gate electrodes structures with a large is epsilon (ε), which, by means of a reduction of the gate of the filling aspect ratio in a replacement gate technology are produced

机译:具有大的金属栅电极结构是ε(ε),通过降低栅在替换栅技术中的填充纵横比来生产

摘要

In the manufacture of complex metal gate electrodes structures with a large ε on the basis of a replacement gate method, the filling conditions during the filling in of the highly conductive electrodes metal, for example of aluminum improved by an upper region of the first outlet work metal, for example, a titanium nitride material in p - transistors, is removed. In some illustrative embodiments, the selective removal of the said metal-containing electrode material in an upper region of the gate opening without a significant increase in the total process complexity is achieved.
机译:在基于替代栅极方法制造具有大ε的复杂金属栅电极结构中,通过第一出口工件的上部区域改善了高导电电极金属(例如铝)的填充过程中的填充条件去除金属,例如p晶体管中的氮化钛材料。在一些说明性实施例中,实现了在栅极开口的上部区域中选择性地去除所述含金属的电极材料而没有显着增加总工艺复杂度。

著录项

  • 公开/公告号DE102011077661A1

    专利类型

  • 公开/公告日2012-12-20

    原文格式PDF

  • 申请/专利权人 GLOBALFOUNDRIES INC.;

    申请/专利号DE20111077661

  • 发明设计人 MARTIN MAZUR;KLAUS HEMPEL;ANDY WEI;

    申请日2011-06-16

  • 分类号H01L21/8234;H01L29/423;H01L27/088;H01L21/283;

  • 国家 DE

  • 入库时间 2022-08-21 16:22:22

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