A method for producing a printing stencil for the technical pressure for the application of a printed pattern on a substrate and printing stencil for the technical pressure

摘要

The present invention relates to a method for producing a printing stencil for the technical pressure for the application of a printed pattern on a substrate and a printing stencil. The method comprises providing a support layer 21 of the printing stencil, providing a structure layer lying under the carrier layer 21 22 of the printing stencil, machining of a longitudinally extending, at least a part of the print pattern corresponding pressure image opening 22a in the structure layer 22, and selectively removing carrier layer openings 21a in the support layer 21 in the region of the pressure image opening 22a. The method is characterized in that in the case of the shaping of the carrier layer openings 21a a laser device is used, which is adapted to a laser beam in laser pulses, and the shaping of the carrier layer, the machining a openings 21 in the longitudinal direction of the pressure image opening extending row of support layer openings 21a, wherein in the case of the machining of a respective carrier layer opening 21 of the series of a focussing means of the laser device at a position of the respective carrier layer opening 21 is positioned and the respective carrier layer opening 21 by means of one or more laser pulses is worked out at this position p1, and the focussing means of the laser device according to machining a carrier layer opening is arranged between two consecutive laser pulses of the position p1 of the crotch carrier layer opening 21a relative to the carrier layer and in the longitudinal direction of the elongated pressure image opening 22a to the position p2 of the following concentration work ends support layer opening process is.