Method for polishing semiconductor wafer, involves providing functional layer of polishing cloth with pores and small blind holes which are arranged in radially inward region and radially outward region

摘要

The method involves polishing the sides of a semiconductor wafer simultaneously using the polishing agent adhered in a polishing cloth which is provided on a polishing plate. The active polishing cloth surface (1) is provided in contact with a surface of the semiconductor wafer. The functional layer (3) of the polishing cloth is provided with pores (2) and small blind holes (4) which are arranged in a radially inward region and a radially outward region. The active surface of polishing cloth is made of polyurethane foam material.