Three-dimensional integrated semiconductor system, has optical interconnection device coupled to photoactive device, where electrical path extends between photoactive device and current/voltage converter

摘要

The system (140) has a semiconductor substrate on insulator (SeOI) (100) including an electrically insulating material layer (104) adjacent to a main surface of a semiconductor material layer (102). An optical interconnection device (116) is coupled to a photoactive device (112) formed on the semiconductor material layer. An electrical path (146) extends between the photoactive device and a current/voltage converter (114) formed on the semiconductor material layer, and the path extends between the current/voltage converter and semiconductor devices (142A, 142B) formed over the SeOI. An independent claim is also included for a method for manufacturing a three-dimensional integrated semiconductor system.