首页> 外国专利> TRANSFER FILM FOR IN-MOLD MOLDING, METHOD OF PRODUCING IN-MOLD MOLDING AND MOLDING

TRANSFER FILM FOR IN-MOLD MOLDING, METHOD OF PRODUCING IN-MOLD MOLDING AND MOLDING

机译:模内转移膜,模内生产方法及模制

摘要

PROBLEM TO BE SOLVED: To provide a transfer film for in-mold molding having excellent heat resistance, durability and moldability, suppressing occurrence of gate flowing and keeping conductivity.SOLUTION: A transfer film for in-mold molding comprises: a transfer layer 11 transferred to an object to be transferred in in-mold molding and being hardenable by irradiation with active energy rays after transfer; and a film-like substrate L0. The transfer layer 11 comprises: a top coat layer L2 laminated on the substrate L0 and arranged on the surface of a molding after in-mold molding; and a conductor layer L4 laminated on the side of the top coat layer L2 opposite to the side of the substrate L0 and on the top coat layer 2. The top coat layer L2 is composed of a mixed composition comprising an active energy ray hardenable resin and a thermosetting resin, and the conductor layer L4 is composed of at least one selected from metals having flexibility, carbon and conductive polymers.
机译:解决的问题:提供一种具有优异的耐热性,耐久性和成型性,抑制浇口流动的发生并保持导电性的模内成型用转移膜。解决方案:模内成型用转移膜包括:转移层11在模内成型中要被转移的物体,并且在转移之后可以通过用活性能量射线照射而硬化;膜状基板L0。转印层11包括:面漆层L2,其层叠在基板L0上,并配置在模内成型后的成型品的表面上。导体层L4层叠在表面涂层L2的与基板L0相反的一侧和表面涂层2上。表面涂层L2由包含活性能量射线固化性树脂和导体层L4由选自具有挠性的金属,碳和导电聚合物中的至少一种构成。

著录项

  • 公开/公告号JP2014117944A

    专利类型

  • 公开/公告日2014-06-30

    原文格式PDF

  • 申请/专利权人 JNC CORP;

    申请/专利号JP20120277481

  • 发明设计人 ITO MASAYA;OKUMA YASUYUKI;

    申请日2012-12-19

  • 分类号B32B15/08;B32B7/02;B29C45/14;

  • 国家 JP

  • 入库时间 2022-08-21 16:19:53

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