首页> 外国专利> SURFACE MOUNTED TYPE ELECTRIC DEVICE, MOTHER BOARD EQUIPPED WITH THE SAME, AND MANUFACTURING METHOD OF MOTHER BOARD EQUIPPED WITH THE SAME

SURFACE MOUNTED TYPE ELECTRIC DEVICE, MOTHER BOARD EQUIPPED WITH THE SAME, AND MANUFACTURING METHOD OF MOTHER BOARD EQUIPPED WITH THE SAME

机译:表面安装型电气设备,配备有该主板的主板以及制造该主板的制造方法

摘要

PROBLEM TO BE SOLVED: To secure sufficient adhesive strength even when the number of support members is reduced and prevent a situation that a surface mounted type electric device is dropped in a reflow process.SOLUTION: A surface mounted type electric device 1 is surface-mounted on a mother board 10 and includes: a circuit board 2 where a surface mounted component 3 is mounted on a mounting surface 2a; and a support member 4 for supporting the circuit board 2 on the mother board 10. The support member 4 is a plate member which is fixed to the mounting surface 2a of the circuit board 2 by an adhesive 5 and includes: a first connection part 4a where one surface faces the mounting surface 2a of the circuit board 2; an extension part 4b which extends from the other surface of the first connection part 4a; and a second connection part 4c which is a plate member arranged parallel with the first connection part 4a and is provided at a tip of the extension part 4b. The adhesive 5 exists in an area ranging from the mounting surface 2a of the circuit board 2 to the other surface of the first connection part 4a.
机译:解决的问题:即使减少支撑构件的数量也要确保足够的粘合强度,并防止表面安装型电子设备在回流过程中掉落的情况。解决方案:表面安装型电子设备1是表面安装的在母板10上,并且包括:电路板2,其中表面安装元件3安装在安装表面2a上;支撑构件4是用于将电路板2支撑在母板10上的支撑构件。支撑构件4是通过粘合剂5固定在电路板2的安装面2a上的板状构件,并具有:第一连接部4a。一个表面面对电路板2的安装表面2a;延伸部4b从第一连接部4a的另一面延伸。第二连接部4c是与第一连接部4a平行设置的板状部件,并设置在延伸部4b的前端。粘合剂5存在于从电路基板2的安装面2a到第一连接部4a的另一面的范围。

著录项

  • 公开/公告号JP2014120739A

    专利类型

  • 公开/公告日2014-06-30

    原文格式PDF

  • 申请/专利权人 SHINDENGEN ELECTRIC MFG CO LTD;

    申请/专利号JP20120277281

  • 发明设计人 NISHIMURA HIDEKI;

    申请日2012-12-19

  • 分类号H05K1/18;H05K3/34;

  • 国家 JP

  • 入库时间 2022-08-21 16:19:45

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