首页> 外国专利> RIGID FLEXIBLE CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR AND RIGID FLEXIBLE CIRCUIT PLATE AND MANUFACTURING METHOD THEREFOR

RIGID FLEXIBLE CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR AND RIGID FLEXIBLE CIRCUIT PLATE AND MANUFACTURING METHOD THEREFOR

机译:刚性挠性电路板及其制造方法以及刚性挠性电路板及其制造方法

摘要

PROBLEM TO BE SOLVED: To provide a rigid flexible circuit board and a manufacturing method therefor, and a rigid flexible circuit plate and a manufacturing method therefor.;SOLUTION: A rigid flexible circuit board includes: a flexible circuit board having an exposure region and a pressure bonding region connected therewith; a core substrate connected with the pressure bonding region; a first adhesive sheet for lamination and a second adhesive sheet for lamination located on both sides of the core substrate and pressure bonding region; and a fifth conductive circuit layer and a sixth conductive circuit layer formed, respectively, on the surfaces of the first and second adhesive sheets for lamination separated from the core substrate. Electric connection bodies are formed on both first and second adhesive sheets for lamination, and the conductive circuit layer of a flexible circuit board is in electric conduction with the fifth and sixth conductive circuit layers by the electric connection bodies. A manufacturing method for the rigid flexible circuit board, a rigid flexible circuit plate and a manufacturing method for the rigid flexible circuit plate are also provided.;COPYRIGHT: (C)2014,JPO&INPIT
机译:解决的问题:提供一种刚性柔性电路板及其制造方法,一种刚性柔性电路板及其制造方法。解决方案:刚性柔性电路板包括:具有暴露区域和柔性结构的柔性电路板。与之相连的压接区;芯基板与压接区域连接;位于芯基板和压接区域两侧的用于层压的第一粘合片和用于层压的第二粘合片;第五导电电路层和第六导电电路层分别形成在与芯基板分开的第一和第二粘合片的表面上。电连接体形成在第一和第二粘合片上以进行层压,并且柔性电路板的导电电路层通过电连接体与第五和第六导电电路层导电。还提供了一种用于刚性柔性电路板的制造方法,一种刚性柔性电路板以及一种用于该刚性柔性电路板的制造方法。;版权所有:(C)2014,JPO&INPIT

著录项

  • 公开/公告号JP2014045164A

    专利类型

  • 公开/公告日2014-03-13

    原文格式PDF

  • 申请/专利权人 ZHEN DING TECH CO LTD;

    申请/专利号JP20120253085

  • 发明设计人 LIU YU-CHEN;

    申请日2012-11-19

  • 分类号H05K3/46;H05K1/02;

  • 国家 JP

  • 入库时间 2022-08-21 16:19:37

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