首页> 外国专利> LIGA-UV PROCESS FOR FABRICATING MULTILAYER METAL STRUCTURE HAVING ADJACENT LAYERS THAT ARE NOT ENTIRELY SUPERPOSED, AND STRUCTURE OBTAINED BY THE PROCESS

LIGA-UV PROCESS FOR FABRICATING MULTILAYER METAL STRUCTURE HAVING ADJACENT LAYERS THAT ARE NOT ENTIRELY SUPERPOSED, AND STRUCTURE OBTAINED BY THE PROCESS

机译:用于制造多层金属结构的LIGA-UV工艺,该多层金属结构没有完全重叠,并且由该工艺获得

摘要

PROBLEM TO BE SOLVED: To improve problems of nonvertical growth of deposited metal and formation of bubbles above a resin when a second electrodeposited layer is not entirely superposed on a first layer.SOLUTION: A photoresist layer is applied on a metal substrate and heated; the layer is exposed through a mask to UV irradiation and developed by dissolving a part not photocured so as to obtain a mold; a first layer of metal or of an alloy is electrodeposited in an open part of the mold; the metal structure and the mold are levelled by machining so as to obtain a planar upper surface; and a metal basecoat layer is deposited on the entire upper surface. Then these steps are repeated. A second layer of metal or an alloy is electrodeposited in the open part of the mold; the multilayer metal structure thus obtained with a cured photoresist is detached from the substrate by interlayer delamination; the photoresist is separated so as to free the multilayer metal structure; and a portion of the metal basecoat layer which is not inserted between two electrodeposited metal layers is removed.
机译:解决的问题:当第二电沉积层未完全叠合在第一层上时,改善沉积金属的非垂直生长和在树脂上方形成气泡的问题。将该层通过掩模暴露于UV辐射下,并通过溶解未光固化的部分而显影以获得模具。在模具的开口部分中电沉积第一层金属或合金;通过机械加工将金属结构和模具调平,以获得平坦的上表面。金属底涂层沉积在整个上表面上。然后重复这些步骤。在模具的开口部分中电沉积第二层金属或合金;通过层间剥离将由此获得的具有固化的光致抗蚀剂的多层金属结构从基板上剥离。分离光致抗蚀剂以释放多层金属结构。然后除去未插入两个电沉积金属层之间的金属底涂层的一部分。

著录项

  • 公开/公告号JP2014177711A

    专利类型

  • 公开/公告日2014-09-25

    原文格式PDF

  • 申请/专利权人 ROLEX SA;

    申请/专利号JP20140115476

  • 发明设计人 SAUCY CLEMENT;

    申请日2014-06-04

  • 分类号C25D1;G04B13/02;G04B15/14;

  • 国家 JP

  • 入库时间 2022-08-21 16:19:24

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