POLYIMIDE TEMPORARY FIXATIVE, TEMPORARY FIXATIVE FILM-DEPOSITED SUBSTRATE, DOUBLE-LAYER TEMPORARY FIXATIVE FILM-DEPOSITED SUBSTRATE, SEMICONDUCTOR COMPOSITE SUBSTRATE, AND SEMICONDUCTOR ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a polyimide temporary fixative enabling, on an occasion for executing a work for processing a compact semiconductor substrate having a small diameter or a small piece shape by using a semiconductor process device accessorizing a large-sized transportation system, the work by temporarily fixing the compact semiconductor substrate to a substrate transportable by the device.;SOLUTION: A polyimide temporary fixative endowed with chemical resistance, adhesive strength, heat resistance, and a function of peeling as a result of heating at a high temperature is used as a temporary fixative for temporarily fixing a compact semiconductor substrate to an adaptation substrate for reshaping the compact semiconductor substrate as a substrate adaptable to a semiconductor production work device transportation system so as not only to enable the transportation thereof to the device but also to ultimately eradicate the need for detaching the compact semiconductor substrate from the composite substrate.;COPYRIGHT: (C)2014,JPO&INPIT