THREE-DIMENSIONAL MONOLITHIC ELECTRONIC-PHOTONIC INTEGRATED CIRCUIT

摘要

PROBLEM TO BE SOLVED: To provide a three-dimensional monolithic electronic-photonic integrated circuit.;SOLUTION: The present invention provides a three-dimensional monolithic electronic-photonic integrated circuit and a method of manufacturing the same. The electronic-photonic integrated circuit includes a photonic element formed in a sealed space within a substrate and an electronic element formed on the substrate. The substrate may include a first substrate and a second substrate that are bonded to each other. The first substrate has a trench corresponding to the sealed space formed therein. A first surface of the second substrate has the photonic element formed thereon. The first surface of the second substrate and the trench constitute the sealed space.;COPYRIGHT: (C)2014,JPO&INPIT