EPOXY RESIN COMPOSITION, ADHESIVE SHEET AND SEMICONDUCTOR ELEMENT

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin composition having thermally conductivity and toughness after curing as well as handleability in good balance, and also provide an adhesive sheet and a semiconductor device.SOLUTION: An epoxy resin composition comprises (A) a high molecular weight compound having mesomorphism or crystallinity and having a number average molecular weight of 1000 or more, (B) an epoxy resin monomer having mesomorphism or crystallinity and having a number average molecular weight of less than 1000, (C) a curing agent, and (D) an inorganic filler. There are also provided an adhesive sheet and a semiconductor device.