RESIN COMPOSITION, PRIMER LAYER FOR PLATING PROCESS, PRIMER LAYER FOR PLATING PROCESS WITH SUPPORT BODY, PRIMER LAYER FOR PLATING PROCESS AFTER CURING, LAMINATE SHEET FOR WIRING BOARD, PROCESS OF MANUFACTURING LAMINATE SHEET FOR WIRING BOARD, MULTILAYER WIRING BOARD, AND PROCESS OF MANUFACTURING MULTILAYER WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a multilayer wiring board including a primer layer for a plating process, excellent in high adhesive force with electroless plating copper even for a resin surface of small surface roughness, having excellent laser workability.SOLUTION: The multilayer wiring board includes: a primer layer for a process containing (A) a multifunctional epoxy resin, (B) an epoxy resin curative agent, (C) a polybutadiene modified polyamide resin containing a phenolic hydroxyl group, and (D) a silica filler; a prepreg for a wiring board; and an inner layer board provided with a circuit process, disposed in this order.