VACUUM SEALED PACKAGE, PRINTED CIRCUIT BOARD WITH VACUUM SEALED PACKAGE, ELECTRONIC APPARATUS AND MANUFACTURING METHOD OF VACUUM SEALED PACKAGE

摘要

PROBLEM TO BE SOLVED: To perform vacuum sealing of a package main body according to a simple system without using any expensive vacuum device.SOLUTION: A vacuum sealed package comprises: a package main body 4 in which a first main body part 1 and a second main body part 2 are joined via a hollow part 3; a getter material G provided within the hollow part 3 of the package main body 4; and an electronic device E. The vacuum sealed package seals the package main body 4 in the state where the hollow part 3 is vacuumed via a through hole 5 communicating the inside of the hollow part 3 and the outside of the package main body 4. In the vicinity of the through hole 5, a low fusing point portion 31 is provided which is partially heated and fused to close the through hole 5 under vacuum. In the vicinity of the through hole 5, the getter material G is mounted or deposited on a surface of the package main body 4 within the hollow part, and a distance between the getter material G and the through hole 5 is set in such a manner that the low fusing point portion 31 can be fused by waste heat.