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Being the semiconductor device where the semiconductor device

机译:成为半导体器件的地方

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device and a method of manufacturing the same including an LDMOS (Laterally Diffused MOS) having a plurality of device withstand voltage zones and good on-resistance on the same wafer or product as compared with a conventional manufacturing method.SOLUTION: The plurality of device withstand voltages and good on-resistance are achieved on the same wafer by separately optimizing thicknesses of a first electric field relaxing oxide film 24, a second electric field relaxing oxide film 25, and an element separation LOCOS (Local Oxidation of Silicon) oxide film 17.
机译:解决的问题:与常规制造相比,提供一种半导体器件及其制造方法,该半导体器件包括具有多个器件耐压区并且在同一晶片或产品上具有良好导通电阻的LDMOS(横向扩散MOS)解决方案:通过分别优化第一电场缓和氧化膜24,第二电场缓和氧化膜25和元件分离LOCOS的厚度,在同一晶片上获得多个器件耐压和良好的导通电阻。氧化硅膜的局部氧化17。

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