首页> 外国专利> PREPREG USING ORGANIC FIBER BASE MATERIAL AND MANUFACTURING METHOD OF THE SAME, AND LAMINATED PLATE, METAL FOIL-CLAD LAMINATED PLATE, AND WIRING BOARD USING THE PREPREG

PREPREG USING ORGANIC FIBER BASE MATERIAL AND MANUFACTURING METHOD OF THE SAME, AND LAMINATED PLATE, METAL FOIL-CLAD LAMINATED PLATE, AND WIRING BOARD USING THE PREPREG

机译:使用相同的有机纤维基材料和制造方法进行预浸,层压板,金属箔复合层压板以及使用预浸板的接线板

摘要

PROBLEM TO BE SOLVED: To provide a prepreg expressing low thermal expansion and high adhesiveness and a manufacturing method of the same, and a laminated plate, a metal foil-clad laminated plate, and a wiring board using the prepreg.;SOLUTION: A thermosetting resin is obtained by reacting, in an organic solvent, (a) a siloxane resin having hydroxyl groups at its terminals represented by following general formula (I) and (b) a compound having at least two or more cyanate groups in one molecule, and contains 10-70 pts.mass of the siloxane resin (a) and 30-90 pts.mass of the compound (b) based on the sum total 100 pts.mass of the siloxane resin (a) and the compound (b). A prepreg is obtained by immersing in an organic fiber base material the thermosetting resin having a reaction rate of the compound (b) of 40-70 mol% and a thermosetting resin composition containing silica and a compound having at least two or more epoxy groups in one molecule.;COPYRIGHT: (C)2014,JPO&INPIT
机译:解决的问题:提供一种表现出低热膨胀性和高粘附性的预浸料及其制造方法,以及使用该预浸料的层压板,覆金属箔的层压板和配线板。通过在有机溶剂中,使(a)在下述通式(I)表示的末端具有羟基的硅氧烷树脂与(b)在一个分子中具有至少两个以上的氰酸酯基的化合物反应而得到树脂。以硅氧烷树脂(a)和化合物(b)的合计100pts的量计,含有10-70pts的硅氧烷树脂(a)和30-90pts的化合物(b)。通过将具有40-70mol%的化合物(b)的反应速率的热固性树脂和包含二氧化硅和具有至少两个以上环氧基的化合物的热固性树脂组合物浸渍在有机纤维基材中而获得预浸料。一分子;版权:(C)2014,JPO&INPIT

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