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PREPREG USING ORGANIC FIBER BASE MATERIAL AND MANUFACTURING METHOD OF THE SAME, AND LAMINATED PLATE, METAL FOIL-CLAD LAMINATED PLATE, AND WIRING BOARD USING THE PREPREG
PREPREG USING ORGANIC FIBER BASE MATERIAL AND MANUFACTURING METHOD OF THE SAME, AND LAMINATED PLATE, METAL FOIL-CLAD LAMINATED PLATE, AND WIRING BOARD USING THE PREPREG
PROBLEM TO BE SOLVED: To provide a prepreg expressing low thermal expansion and high adhesiveness and a manufacturing method of the same, and a laminated plate, a metal foil-clad laminated plate, and a wiring board using the prepreg.;SOLUTION: A thermosetting resin is obtained by reacting, in an organic solvent, (a) a siloxane resin having hydroxyl groups at its terminals represented by following general formula (I) and (b) a compound having at least two or more cyanate groups in one molecule, and contains 10-70 pts.mass of the siloxane resin (a) and 30-90 pts.mass of the compound (b) based on the sum total 100 pts.mass of the siloxane resin (a) and the compound (b). A prepreg is obtained by immersing in an organic fiber base material the thermosetting resin having a reaction rate of the compound (b) of 40-70 mol% and a thermosetting resin composition containing silica and a compound having at least two or more epoxy groups in one molecule.;COPYRIGHT: (C)2014,JPO&INPIT
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