PREPREG USING ORGANIC FIBER BASE MATERIAL AND MANUFACTURING METHOD OF THE SAME, AND LAMINATED PLATE, METAL FOIL-CLAD LAMINATED PLATE, AND WIRING BOARD USING THE PREPREG

摘要

PROBLEM TO BE SOLVED: To provide a prepreg expressing low thermal expansion and a manufacturing method of the same, and a laminated plate, a metal foil-clad laminated plate, and a wiring board using the prepreg.;SOLUTION: A thermosetting resin is obtained by reacting, in an organic solvent, (a) a siloxane resin having hydroxyl groups at its terminals represented by following general formula (I) and (b) a compound having at least two or more cyanate groups in one molecule, and contains 10-70 pts.mass of the siloxane resin (a) and 30-90 pts.mass of the compound (b) based on the sum total 100 pts.mass of the siloxane resin (a) and the compound (b). A prepreg is obtained by immersing, in an organic fiber base material, the thermosetting resin having a reaction rate of the compound (b) of 40-70 mol% and a thermosetting resin composition containing silica. In general formula (I), each R₁ is independently an alkylene group having 1-5 carbon atoms or an alkyleneoxy group; each Ar₁ is independently a single bond, an arylene group, or an alkylene group having 1-5 carbon atoms; and m is an integer of 5-100.;COPYRIGHT: (C)2014,JPO&INPIT