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SIC COMPACT AND METHOD FOR MANUFACTURING SIC COMPACT

机译:SIC紧凑型及制造SIC紧凑型的方法

摘要

PROBLEM TO BE SOLVED: To provide a CVD-SiC compact which has low light permeability and high electrical resistivity and can be favorably used for an etcher member and so on used in a semiconductor manufacturing process.;SOLUTION: An SiC compact, formed by the CVD method, includes boron atoms by 1-30 mass ppm, and nitrogen atoms by more than 100 mass ppm and equal to or less than 1000 mass ppm. Preferably, electrical resistivity is more than 10 Ω cm and equal to or less than 100000 Ω cm, and light permeability is 0-1% at a wavelength of 950 nm.;COPYRIGHT: (C)2014,JPO&INPIT
机译:解决的问题:提供一种CVD-SiC压粉体,其具有低的透光率和高的电阻率,并且可以有利地用于在半导体制造过程中使用的蚀刻构件等。 CVD方法包括1-30质量ppm的硼原子和大于100质量ppm且等于或小于1000质量ppm的氮原子。优选地,电阻率大于10Ωcm且等于或小于100000Ωcm,并且在950 nm的波长下透光率为0-1%.;版权所有:(C)2014,JPO&INPIT

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