CHEMICALLY AMPLIFIED POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND INTERLAYER INSULATING FILM

摘要

PROBLEM TO BE SOLVED: To provide a chemically amplified positive photosensitive resin composition having high dry etching resistance while retaining high sensitivity.;SOLUTION: A chemically amplified positive photosensitive resin composition contains (A) a polymer component described below, (B) a photoacid generator, (C) a compound represented by the general formula (1) described below, and (D) a solvent. The polymer component (A) contains a polymer satisfying at least one of (1) and (2) in the following: (1) a polymer having (a1) a constitutional unit having a residue from protection of an acid group with an acid decomposable group and (a2) a constitutional unit having a crosslinkable group; and (2) a polymer having (a1) the constitutional unit having a residue from protection of an acid group with an acid decomposable group, and a polymer having (a2) the constitutional unit having a crosslinkable group. The general formula (1) is defined as (R¹)_4-n-Si-(OR²)_n, where: R¹ represents a hydrocarbon group not having a reactive group; R² represents an alkyl group; and n is an integer in the range from 1 to 3.;COPYRIGHT: (C)2014,JPO&INPIT