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Shape memory resin composition, shape memory resin molded body, and manufacturing method of shape-memory resin molded body

机译:形状记忆树脂组合物,形状记忆树脂成型体以及形状记忆树脂成型体的制造方法

摘要

PPROBLEM TO BE SOLVED: To provide a shape-memory resin composition, a shape-memory resin molding, and a method for producing a shape-memory resin molding that enhance heat resistance and allow deformation operation at low temperature. PSOLUTION: The shape-memory resin composition contains: a crystalline resin component having a plurality of crosslinking functional groups in a molecule which become crosslinking moieties; a linker which allows crosslinking of the crystalline resin component by bonding to the plurality of crosslinking reactive groups, and an additive. The crosslinking moiety produced when the crystalline resin component is crosslinked via the linker has a hydrogen donor or a hydrogen acceptor in a hydrogen bond. The additive has a hydrogen acceptor or a hydrogen donor in a hydrogen bond so that the hydrogen bond to the crosslinking moiety can be formed. PCOPYRIGHT: (C)2011,JPO&INPIT
机译:

要解决的问题:提供一种形状记忆树脂组合物,一种形状记忆树脂模制品,以及一种用于生产形状记忆树脂模制品的方法,其提高了耐热性并允许在低温下变形。

解决方案:形状记忆树脂组合物包含:结晶树脂组分,其在分子中具有多个成为交联部分的交联官能团;和通过与多个交联反应性基团键合而使结晶性树脂成分交联的连接剂和添加剂。当结晶性树脂组分通过接头交联时产生的交联部分在氢键中具有氢供体或氢受体。添加剂在氢键中具有氢受体或氢供体,从而可以形成与交联部分的氢键。

版权:(C)2011,日本特许厅&INPIT

著录项

  • 公开/公告号JP5522513B2

    专利类型

  • 公开/公告日2014-06-18

    原文格式PDF

  • 申请/专利权人 日本電気株式会社;

    申请/专利号JP20090232764

  • 发明设计人 井上 和彦;

    申请日2009-10-06

  • 分类号C08L75/06;C08K5/205;C08L67/02;C08K5/00;C08L101/16;

  • 国家 JP

  • 入库时间 2022-08-21 16:16:51

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