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Superposing the production method, and the electric junction box null circuit baseplate and the bus bar

机译:叠加生产方法,电接线盒空回路基板和母线

摘要

PROBLEM TO BE SOLVED: To arrest the lifting of the rim of an opening in a circuit board from a bus bar, and to connect an electronic component, including a semiconductor relay without fail, to the bus bar.;SOLUTION: A circuit structure 30 is formed by overlapping the circuit board 31 and the bus bar 32 together. The circuit structure includes an opening 33 so formed that it penetrates the circuit board 31; a semiconductor relay 48 mounted in the opening 33; a board-side anchoring window 34, formed at a position adjacent to the opening 33 so that it penetrates the circuit board 31; a bus bar-side anchoring window 42, formed at a position corresponding to the board-side anchoring window 34 so that it penetrates the bus bar 32; an regulating piece 35 so provided that it extends from the rim of the board-side anchoring window 34 and is bent to the bus bar 32 side at the rim of the bus bar-side anchoring window 42; and an anchoring window molding portion 47, formed by insertion-molding the bent regulating piece 35 and the rim of the bus anchoring window 42.;COPYRIGHT: (C)2011,JPO&INPIT
机译:解决的问题:阻止从母线上抬起电路板上开口的边缘,并将电子器件(包括半导体继电器)可靠地连接到母线上;解决方案:电路结构30通过将电路板31和汇​​流条32重叠在一起而形成图1所示的电路板。电路结构包括开口33,该开口33形成为穿透电路板31。半导体继电器48安装在开口33中;板侧固定窗34形成在与开口33相邻的位置处,以使其穿透电路板31。母线侧固定窗42形成在与板侧固定窗34对应的位置,以贯穿母线32。调节片35设置成从板侧锚固窗口34的边缘延伸并且在汇流条侧锚固窗口42的边缘处弯曲至汇流条32侧。锚固窗成型部47,其是通过将弯曲的限制片35和母线锚固窗42的边缘插入成型而形成的。版权所有(C)2011,日本特许厅

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