Conductive silver paste , forming method and a conductive pattern printed conductive pattern

摘要

PROBLEM TO BE SOLVED: To provide a conductive silver paste with which a conductive pattern with excellent adhesion to a substrate can be obtained within a short time of 10 minutes even at a low temperature below 150°C.;SOLUTION: The conductive silver paste contains silver particles (A) with a median size (D50) in the range of 0.2 to 0.9 μm, a vinyl chloride-vinyl acetate copolymer (B) containing 3 to 9 wt.% of copolymerization units of vinyl alcohol and/or (meth-) acrylic acid hydroxyalkyl ester in the copolymer, and an organic compound (C) which dissolves the copolymer (B), does not show reactivity with the copolymer(B), and is in a liquid state at 25°C, as essential components. A conductive pattern is formed by printing with the conductive silver paste on a substrate, and a printed matter with the conductive pattern is formed by a method for forming the conductive pattern.;COPYRIGHT: (C)2012,JPO&INPIT