The production mannered null long shaku resin film

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a metallized resin film substrate, improving productivity of a double-layer metallized resin film substrate used as a flexible wiring board, and simultaneously achieving dimensional stability and elimination of discoloration such as a stain.;SOLUTION: When a plurality of feeding rolls 6a-6d feed to a metal thin film to electroplate a surface of the metal thin film while a resin film F with the metal thin film is repeatedly immersed in a plating liquid 4 to be conveyed, a plating liquid or water at a temperature of 10-32°C is sprayed, between each of the feeding rolls 6a-6d and a liquid level of the plating liquid 4, on a surface of the resin film F with the metal thin film, wherein the surface does not face anodes 8a-1, 8a-2, 8b-1, 8b-2, 8c-1, 8c-2, 8d-1 and 8d-2.;COPYRIGHT: (C)2012,JPO&INPIT