首页> 外国专利> Cu-Mg-P BASED COPPER ALLOY SHEET HAVING EXCELLENT SPRING CRITICAL VALUE CHARACTERISTIC AND FATIGUE RESISTANCE AFTER BENDING, AND METHOD FOR PRODUCING THE SAME

Cu-Mg-P BASED COPPER ALLOY SHEET HAVING EXCELLENT SPRING CRITICAL VALUE CHARACTERISTIC AND FATIGUE RESISTANCE AFTER BENDING, AND METHOD FOR PRODUCING THE SAME

机译:弯曲后具有出色的临界值特性和耐疲劳性的基于Cu-Mg-P的铜合金板及其制造方法

摘要

PROBLEM TO BE SOLVED: To provide a Cu-Mg-P based alloy sheet having excellent spring critical value properties and fatigue properties after bending, and a method for producing the same.;SOLUTION: The copper alloy sheet has a composition comprising, by mass, 0.2 to 1.2% Mg and 0.001 to 0.2% P, and the balance Cu with inevitable impurities. In crystal orientation analysis by an EBSD measurement method according to the observation in SEM of the surface parallel to a rolling face, in the case the orientations of all pixels in a measurement area range are measured at the step size of 1.0 μm, and the boundary in which the orientation difference between the adjacent pixels is 15° or higher is defined as a crystal boundary, Brass orientation density is 4 to 19%, Copper orientation density is 2 to 13%, all crystal grain sizes are 10 μm, and the area ratio of the crystal grains with the crystal grain sizes of 5 μm or lower is 75% or higher.;COPYRIGHT: (C)2014,JPO&INPIT
机译:解决的问题:提供一种具有优异的弯曲后的弹簧临界值特性和疲劳特性的Cu-Mg-P基合金薄板及其制造方法。解决方案:铜合金薄板的组成包括按质量计,0.2%至1.2%的Mg和0.001%至0.2%的P,其余部分含不可避免的杂质。在根据与平行于滚动面的表面的SEM中的观察通过EBSD测量方法进行的晶体取向分析中,在测量区域范围内的所有像素的取向以1.0μm的步长和边界进行测量的情况下将相邻像素之间的取向差为15°或更高的定义为晶界,黄铜取向密度为4至19%,铜取向密度为2至13%,所有晶粒尺寸为10μm,并且面积晶粒度为5μm以下的晶粒的比率为75%以上。;版权所有:(C)2014,JPO&INPIT

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