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The luminous device assembly which improves coefficient of thermal conductivity, the system and the coefficient of thermal conductivity which include that being the methodological luminous

机译:改善导热系数的发光装置组件,包括方法学上的发光的系统和导热系数

摘要

PROBLEM TO BE SOLVED: To provide light-emitting device/assembly, system and method capable of enhancing radiation performance of heat from an LED.;SOLUTION: A light-emitting device/assembly (10, 50) comprises: a light-emitting diode chip (100, 500-1, 500-N); a substrate having two terminals; and one or more enclosure layer (108, 508). The first terminal (101, 501) has at least the same width as the LED chip, and has a part (103, 503) having the vertical cross-sectional area, the part being at least 30% that of the whole assembly thus enclosed. The one or more enclosure layer (108, 508) houses an adhesive (102, 502-1, 502-N) for connecting the LED chip to the first terminal.;COPYRIGHT: (C)2013,JPO&INPIT
机译:要解决的问题:提供一种能够增强来自LED的热量的辐射性能的发光装置/组件,系统和方法。解决方案:发光装置/组件(10、50)包括:发光二极管芯片(100,500-1,500-N);具有两个端子的基板;一个或多个外壳层(108、508)。第一端子(101、501)具有至少与LED芯片相同的宽度,并且具有具有垂直横截面面积的部分(103、503),该部分至少是由此封装的整个组件的30%。 。一个或多个外壳层(108、508)容纳用于将LED芯片连接到第一端子的粘合剂(102、502-1、502-N)。版权所有:(C)2013,JPO&INPIT

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