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The luminous device assembly which improves coefficient of thermal conductivity, the system and the coefficient of thermal conductivity which include that being the methodological luminous
The luminous device assembly which improves coefficient of thermal conductivity, the system and the coefficient of thermal conductivity which include that being the methodological luminous
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机译:改善导热系数的发光装置组件,包括方法学上的发光的系统和导热系数
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摘要
PROBLEM TO BE SOLVED: To provide light-emitting device/assembly, system and method capable of enhancing radiation performance of heat from an LED.;SOLUTION: A light-emitting device/assembly (10, 50) comprises: a light-emitting diode chip (100, 500-1, 500-N); a substrate having two terminals; and one or more enclosure layer (108, 508). The first terminal (101, 501) has at least the same width as the LED chip, and has a part (103, 503) having the vertical cross-sectional area, the part being at least 30% that of the whole assembly thus enclosed. The one or more enclosure layer (108, 508) houses an adhesive (102, 502-1, 502-N) for connecting the LED chip to the first terminal.;COPYRIGHT: (C)2013,JPO&INPIT
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